Electronics Hardware Engineer

Job Title: Electronics/Hardware Engineer (RF/Antenna, PCB, MicroLED Driver, SI/PI, Packaging)

Company: Goertek (Global Leading Smart Hardware & Microdisplay Manufacturer)

Location: Qingdao | Shanghai | Shenzhen | Jinan | Vietnam

Job Type: Full-time

The Role:
We are seeking talented Electronics/Hardware Engineers to join our R&D teams working on microLED displays, wireless communication systems, and high-speed digital circuits. You will be involved in the full product lifecycle from concept to mass production. Multiple openings available across five specializations.

Open Specializations:

Direction 1: Antenna/RF Engineering – Qingdao

Perform simulation, design, and testing of antennas and RF circuits.

Debug RF performance issues, optimize matching networks, and conduct compliance testing.

Requirement: Master's in RF Design, Communication Engineering, or Electromagnetic Fields; familiarity with RF test instruments (spectrum analyzers, network analyzers) is a plus.

Direction 2: Hardware Design – Qingdao/Vietnam

Evaluate platforms and functional modules, output feasibility assessment reports.

Design schematics, generate BOM, support PCB layout review, and manage component sourcing.

Develop test specifications, execute circuit validation, and support production line issue resolution.

Requirement: Master's in EE, Automation, or related fields; proficiency in circuit simulation tools and lab equipment (oscilloscopes, logic analyzers).

Direction 3: Platform/System Engineering (MicroLED Driver) – Shenzhen/Shanghai/Jinan

Design embedded control systems for microLED displays, including driver circuits, control modules, and interface circuits.

Develop platform drivers supporting SPI/I2C/MIPI;熟悉 TCP/IP, USB2.0, UART protocols.

Build algorithm validation platforms and collaborate with software/algorithms teams.

Requirement: Master's in EE/Microelectronics; proficiency in Keil, QT, Cadence, Allegro, C/C++; experience with MCU/ARM hardware design; Linux/Android driver or host PC software experience is a plus.

Direction 4: Signal/Power Integrity Simulation – Jinan/Shanghai

Design PCB/FPC layouts for microLED driver boards and control circuits.

Optimize impedance matching, differential signal routing, decoupling capacitors, and grounding for SI/PI integrity.

Build SI/PI simulation systems using Sigrity/Ansys; resolve SI/PI-related product issues.

Requirement: Master's in EE/Microelectronics; familiarity with high-speed/multi-layer PCB design; experience with SI/PI simulation is highly preferred; English as working language is a plus.

Direction 5: Electronics Packaging & Test Automation – Qingdao

Design test solutions for product verification, including equipment selection and parameter configuration.

Conduct design-for-testability (DFT) reviews, validate test coverage, and generate failure analysis reports.

Develop test automation frameworks and scripts; maintain automated test systems.

Requirement: Master's in EE, Microelectronics, or related fields; proficiency in Cadence/PADS/AD; strong foundation in analog/digital circuits; English/Korean/Japanese as working language is a plus.

Qualifications (General):

Master's degree or above in Electronics Engineering, Communication Engineering, Electromagnetic Fields, Automation, Computer Science, or related fields.

Strong foundation in analog/digital circuits and electromagnetic theory.

Hands-on experience with oscilloscopes, logic analyzers, spectrum analyzers, or network analyzers.

Excellent problem-solving skills and ability to collaborate across mechanical/software/firmware teams.

Self-motivated, detail-oriented, and adaptable to fast-paced R&D and production environments.

Why Join Us?

Work on cutting-edge microLED display and wireless technologies.

Global R&D platform with cross-border team collaboration (China, US, Singapore, Vietnam).

Competitive compensation + relocation support.

Opportunity to publish patents and technical papers.