Failure Analysis Intern

About The Role

The Materials Scientist / Failure Analysis Intern will support hands‑on failure analysis and materials characterization of advanced wafer‑scale AI hardware. In this role, you will work closely with our Reliability and Electrical Engineering teams to investigate physical failure mechanisms across components, assemblies, and systems. Through sample preparation, microscopy, and materials analysis, you will help connect physical evidence to electrical and system‑level failure behavior, contributing directly to root‑cause understanding and reliability improvements in high‑performance hardware.

Responsibilities

• Support failure analysis and materials characterization across DCM4 (MCM/MCD), DCM6, GBX + ISC, wafer attach, microchannel coolers, and critical PCBAs.
• Prepare samples for cross-sectioning, polishing, and optical inspection of solder joints, wafer attach interfaces, and interconnect structures.
• Operate SEM for high-resolution imaging and assist with EDS elemental analysis for contamination, corrosion, and defect characterization.
• Document structural defects including cracking, voiding, delamination, residue, and plating anomalies.
• Work closely with Reliability and EE teams to correlate physical defects with electrical failure signatures.
• Maintain structured FA documentation and image databases for traceability and reporting.